The device is suitable for high-speed laser etching and stripping of conductive materials on Glass substrate.The equipment is equipped with a 3200mmx2400mm oversize loading platform, which can perform automatic image positioning and automatic high-speed laser etching processing for oversize workpiece.The device carries the functions of automatic positioning laser marking two-dimensional code and reading two-dimensional code, and can also realize integrated product quality traceability.
Product features
1. Laser etching is dry etching, the processing process is simple, all processing is automatically controlled by software, the product has high consistency, yield up to 99%, consumables free, environmental protection, reliable and stable.
2.CCD camera automatic positioning, high processing precision.
3. Simple operation of equipment, convenient update of drawing file, short process, high moving rate.
4. The equipment control software can realize automatic image file segmentation, mobile splicing processing, splicing accuracy up to ±4 m
5. Low power consumption, few operators, no pollution and low production cost.
Applied materials
Ultrafine linewidth laser etching of indium tin oxide (ITO) on glass surface, silver paste (Ag), carbon nanotube (CNT), graphene, nano silver, molybdenum, aluminum, copper, conductive polymer film, aluminum film, PERC, perovskite cell, FTO, TCO and other coating materials.
Application industry
1. Touch screens GF, GFF and OGS, such as mobile phones, cars, tablets, smart wearables and food ordering machines.
2. Etching of conductive film layer on OGS of on-board touch screen body.
3. Thin-film solar cells, photovoltaic industry.
4. Emerging energy industries.
5. Other displays.