Copper Tungsten Electronic Packaging Materials (excellent high temperature stability)

HEAT SPREADER MATERIALS
Power electronics and circuits produce a lot of heat when they work. Heatspreder materials help to eliminate chip heat, transferring it to other media and keeping the chip stable.
Molybdenum copper, tungsten copper, CMC and CPC materials,combined with low thermal expansion rate of molybdenum, tungsten and conductivity of copper heat, can effectively release the heat of electronic device and contributes to the cooling of IGBT module, RF power amplifier, LED chips and other products. They are thus applied as a metal substrate,thermal control and heat insulation components ( heat spreader materials ) and the lead frame in large-scale integrated circuit and high power microwave devices.
We can offer WCu,MoCu,CMC,Cu/MoCu/Cu finished and semi-finished products. And we can also provide these products coated with Ni, NiAu or NiAg.WCu alloy
W-Cu electronic packaging materials possess both the low expansion of tungsten and the high thermal conductivity of copper. What is particularly valuable is that its thermal expansion coefficient and thermal conductivity can be adjusted by the material composition and then be designed so as to bring great convenience of the applications of the material. We use high-purity raw materials with good quality, and then by molding, sintered and infiltrated at high temperature, the W-Cu electronic packaging materials and heat sink material with excellent performance are made. It is suitable for material for the package of high-power device, such as substrate, electrodes and so on; the lead frame of good performance; military and civilian thermal control device such as thermal control board and the heat sink.
Advantages: low thermal expansion coefficient; high thermal conductivity; excellent high temperature stability; uniformity and excellent processing properties.
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