Molybdenum-Copper Heat Sinks Spreaders Applicated in High Power Diode Packaging

HEAT SPREADER MATERIALS
Power electronics and circuits produce a lot of heat when they work. Heatspreder materials help to eliminate chip heat, transferring it to other media and keeping the chip stable.
Molybdenum copper, tungsten copper, CMC and CPC materials,combined with low thermal expansion rate of molybdenum, tungsten and conductivity of copper heat, can effectively release the heat of electronic device and contributes to the cooling of IGBT module, RF power amplifier, LED chips and other products. They are thus applied as a metal substrate,thermal control and heat insulation components ( heat spreader materials ) and the lead frame in large-scale integrated circuit and high power microwave devices.
We can offer WCu,MoCu,CMC,Cu/MoCu/Cu finished and semi-finished products. And we can also provide these products coated with Ni, NiAu or NiAg.MoCu alloy
MoCu alloy is a kind of pseudo-alloy that is composed of Molybdenum and copper. It consists of both the characteristics of molybdenum and copper, having high thermal conductivity, low adjusted thermal expansion coefficient, being non-magnetic, low content of gas, good vacuum resistance, good machinability and special high-temperature, etc.
Compared with WCu alloy, MoCu alloy has lower density and is easier to stamp. It makes MoCu suitable for volume produce.
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