Supplier Homepage Packaging & Printing Pre-Press Equipment Exposure Machine China 6 Inch Mask Aligner MD-Sb-601A &B C

China 6 Inch Mask Aligner MD-Sb-601A &B C

Min. Order / Reference FOB Price
1 Piece	US $75000.00/ Piece

Local Area:	Guangzhou, Guangdong, China
R&D Capacity:	OEM, ODM, Other
Payment Terms:	LC, T/T, PayPal, WesternUnion

Usage:	Semiconductor
Type:	Plate Exposure
Page:	Single Face

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Product Description

6 inch Mask Aligner MD-SB-601A &B/C

MD-SB-601A &B/C

The machine is mainly designed for single or double sides aligning and exposure process of power device, sensors, photoelectron device, micro wave circuit, MEMS and other late-model electronic component etc.
Main Features
Alignment: Liner guideway and rolling bearing, accurate movement of X,Y and θ direction, high precision alignment between substrate and mask
Cover and Z-axis: Unique cover system, adjustment and display of contact force between mask and substrate, accurate separation and contact between mask and substrate
Exposure system: Pole fly's lens and ellipsoidal reflector with high light gathering power, large exposure area, high uniformity and printing resolution
Bottom and Top side alignment: Alignment system with large scan range, clear image and high positioning precision.
Objective with subminiature motorized driver,unattached Three-dimensional adjustment of X, Y and Z direction, linear adjustable movement velocity
Automation transfer: Automatically handling substrate with multi-joint robot arm and pre-alignment station, higher productivity
Wedge compensation system:Advanced air bearing, wedge compensation with high speed and precision, high DOF, good leveling effect
Power of mercury lamp:High performance and constant power,excitated easily and high reliability, safety protect function

Main Specifications:
Mask aligner parameters:
Size of Wafer:Max. φ6″
Size of mask:Max. 7″x 7″
Precision of double-sides aligning: 2.0μm
Magnification: 90x,175x,350x
Alignment parameters: MK
Alignment travel: X/Y: ±5mm
Revolving of θ-axis: ±5°(Model C);
±3° (Model A,B)
Z-axis parameters:
Z-axis travel: 10mm
Exposure system parameters:
Printing resolution: 1.5μm (vacuum contact)
Max exposure area: φ160mm,UV400
Non-uniformity: ±5%(φ160mm);±3%(φ110mm)
Light intensity: ≥10mW/cm2(1000W lamp)
Bottom and top side alignment parameters:
Separation between objectives:
30~100mm(BSA)(Model B,C) 60~100mm(BSA)(Model A) 30~145mm(TSA)
Accuracy of pre alignment station parameters:
Pre-alignment station accuracy:
±60μm(optional, just for φ4″and φ6″wafer)

Facilities:
Voltage:~220V±22 V(50Hz)
Power consumption:1.5KW
Light: Red or yellow
Air pressure: 0.5~0.7MPa
N2 pressure:0.2~0.4MPa
Vacuum: -0.08~-0.1MPa
Dimensions & Weight:
Overall Dimensions:
1500mmx1100mmx1860mm (Model A)
940mmx1100mmx1860mm (Model B,C)
Weight:500kg(A)
400kg(B,C)

Comprason table:

Model:

Mask Size

Wafer Size

Exposure

Type

Manual /Automatic

Application has been in

MD-BG-401A

5inch

4inch

Single side