Supplier Homepage Packaging & Printing Pre-Press Equipment Exposure Machine China One Side Dual Side Exposure Machine MD-Bg-406

China One Side Dual Side Exposure Machine MD-Bg-406

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Min. Order / Reference FOB Price
1 Piece	US $75000.00/ Piece

Local Area:	Guangzhou, Guangdong, China
R&D Capacity:	OEM, ODM, Other
Payment Terms:	LC, T/T, PayPal, WesternUnion

Usage:	Semiconductor
Type:	Plate Exposure
Page:	Single Face

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Product Description

One side dual side exposure machine MD-BG-406

The series of MD-BG-406 Mask Aligners could be used in aligning and exposure process of small or middle scale IC, Diode, dynatron, GPP, LED , Power Electronic Devices, and any other semiconductor devices. The series of Mask Aligners include 4″/6″single/double surface Mask Aligner, and could realize single/double surface aligning and single surface exposure.

Main Feature:
Alignment
Alignment provides high precision and less. Three-point paralleling with less force is achieved by wedge error compensation, and the use life mask is prolonged.
Exposure system
Pole fly,s lens and ellipsoidal reflector with high light gathering power.
Split view field microscope
Large scan and observing range by joy stick in X and Y direction ,shifting between single field and double fields, shift between single field and double field, higher alignment efficiency and overprint precision, compatibility of image display function with CCD.
Control System
Operation is convenient by Industrial Personal Computer in electric control system, clear human-computer interface, and high reliability and stability could be obtained. Stability and reliability of the equipment are improved by use of key parts from import or professional manufacturer, and personal service is provided for different user.

Main Specification:
Alignment travel
X-axis: ±5mm Y-axis:±5mm
Z X-axis:8mm θY-axis:±5°
Size of mask: 7″x7″
Size of wafer: φ6″
soft, hard and vacuum contact
proximity, flood exposure
Topside Microscopes
Total magnification
100X (50Xoptional)
Range of scan: 50mmx50mm
Range of focus: 8mm
Separation between objective
28-90mm(φ4″wafer)
75-150mm(φ4″-φ6″wafer)
Alignment accuracy:±0.5um
Bottomside Microscopes
Total magnification 330X
Separation between objective
X-axis:50-140mm
Y-axis:±12mm
Alignment accuracy:±2um
Exposuring Resolution:
1um(vacuum contact)
Exposure gap1-500um
Max Exposure area: φ160 mm orφ108 mm
Exposure time:0-999s continuous setting
non-uniformity of Exposure:±5% (Max Exposure area: φ160 mm)
±3% (Max Exposure area: φ108mm)
Exposure system and wavelength:
250W High pressure mercury lamp,UV365

Facilities:
Voltage: ~220v±22v(50Hz)
Power consumption: 1KW
Light: Red or yellow
Air pressure: 0.5~0.7MPa
N2 pressure: 0.2~0.4MPa
Vacuum: -0.08~-0.14MPa
Dimensions&Weight:
Overall Dimensions:1022mmx850mmx1330mm
weight: 350kg

Comprason table:

Model:

Mask Size

Wafer Size

Exposure

Type

Manual /Automatic

Application has been in

MD-BG-401A

5inch

4inch

Single side